The US-JOINT consortium, formed of semiconductor suppliers looking to advanced packaging and back-end processing technologies in California’s Silicon Valley, has welcomed 3M as its newest member.
Formed in 2023 by semiconductor and electronics specialist Resonac, US-JOINT supports end-customer collaboration to verify requirements for semiconductor packaging of advanced devices and validate new concepts in development.
The group has a research and development (R&D) site in Union City, California, which was set up through co-investment with the partners. Work was underway at the facility last year, and it is expected to be fully operational in 2025.
Hidenori Abe, Chief Technology Officer for semiconductor materials at Resonac, welcomed 3M to the consortium.
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