India’s Union Cabinet has approved four more semiconductor projects worth Rs 4,600 crore ($554m).
The approved proposals were from SiCSEM, Continental Device India Private Limited, 3D Glass Solutions and Advanced System in Package Technologies, with manufacturing units to be set up in Odisha, Punjab and Andhra Pradesh.
SiCSEM is establishing an integrated silicon carbide compound semiconductor facility in Bhubaneshwar, Odisha, and the commercial compound fab will have the capacity to produce 60,000 wafers annually and package 96 million units.
The latest announcement follows , as India seeks to ramp up its semiconductor sector and create ‘technological self reliance’. Currently around 90% of its semiconductor chips are imported.
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