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44 min ago 2 min read
Stockholm-headquartered MEMS manufacturer Silex Microsystems has agreed to acquire a $40m semiconductor fabrication facility in Pennsylvania as part of a SEK 1.6bn ($165m) investment to establish its first US manufacturing footprint.
Silex will acquire the 200mm wafer fabrication site from Arizona-headquartered semiconductor specialist Semiconductor Components Industries (Onsemi), with the facility set to be converted into a dedicated MEMS manufacturing site.
The facility includes around 3,000 square metres of existing cleanroom space, with a further 12,000 square metres available for future expansion.
Ultra-high purity gases are critical to the deposition, etching, doping, and cooling MEMS fabrication stages, while also supporting a stable manufacturing environment.
The company expects the project to represent a total investment of around SEK 1.6bn ($165m), with the deal expected to close at the end of 2027, subject to necessary approvals.
By 2034, Silex expects the new facility to reach revenues and profitability levels comparable to its Swedish 200mm fab in 2025.
Edvard Kalvesten, CEO of Silex, said, “This [acquisition] brings us closer to our US customers, shortens lead times and reduces geopolitical exposure.”
MEMS technology can be integrated into medical devices, autonomous vehicles, and software.
In a recent webcast, Kalvesten shared that at most one or two projects will be moved over from Sweden, as the US fab is expected to support new customer programmes and future growth rather than simply relocate existing production.
According to market research, the global MEMS market was valued at an estimated $17.52bn in 2025, with a North American market share of around 23%.
