Linde India secures land for semiconductor packaging plant in Gujarat

The India business of industrial gas major Linde has acquired land to build a semiconductor packaging facility in Sanand, Gujarat.

It will be the second facility in the region under development by Linde, as it looks to capitalise on the state’s growing reputation as a chipmaking hub.

According to Milan Sadhukhan, Managing Director at Linde India, the company has secured around eight acres of land in Sanand and discussions with potential customers are already underway.

Semiconductor packaging mainly relies on inert and specialty gases to prevent oxidation, manage heat, and test package integrity.

Linde is also (ASU) in the state, which will likely be ready in the second half of 2027. It is expected to supply high-purity bulk gases via pipeline to service the Tata Group’s upcoming $11bn semiconductor fab.

The company currently operates an ASU in Dahej and a packaged gases unit in Ahmedabad.

Gujarat has already attracted investments worth over $13.66bn in the semiconductor sector. Of the 12 semiconductor projects approved by the Government of India, six are located in the state.

The projects form part of India Semiconductor Mission 2.0 – the $13.2bn second phase of India’s national initiative to build a complete, self-reliant semiconductor and display manufacturing ecosystem.

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Earlier this year, INOX Air Products of Micron’s $2.75bn semiconductor facility in Gujarat. The company is also developing a $58m electronic speciality gas hub in Dholera to supply future chip making projects across the state.

There has also been a boost in foreign investment. In September, US semiconductor equipment maker LAM Research committed $1.19bn to set up the country’s first semiconductor component manufacturing unit, with plans to use India as an export hub.