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34 min ago 2 min read
Global technology giant Siemens and semiconductor chip manufacturer Taiwan Semiconductor Manufacturing Company (TSMC) have expanded their partnership to advance AI-powered automation for semiconductor design.
The partnership builds on existing work, which focuses on expanding automation across electronic design automation (EDA) workflows.
As part of the effort, Siemens will integrate its Fuse EDA AI System, an AI platform designed to automate multiple steps across chip design, which it says will improve productivity in chip design tasks.
The collaboration also covers advanced chip designs, including 3D IC architectures using TSMC’s 3DFabric technology. Siemens tools are being used for verification, connectivity checks and thermal analysis of these designs.
Additionally, Siemens and TSMC are also working on support for advanced chip manufacturing nodes, specifically TSMC’s 3nm, 2nm, A16, and A14 process technologies.
Additional work includes silicon photonics and TSMC’s Compact Universal Photonic Engine (COUPE), supported through Siemens design and verification tools for next-generation chip development.
Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC, said, “[The partnership is] driving energy-efficient chip innovation, paving the way for advancements in the semiconductor industry during this transformative era of AI.”
Last week, TSMC outlined in its first-quarter earnings report that AI demand is set to for at least the next two years, despite a global investment push.
The companies said the collaboration will improve efficiency across chip design workflows and support growing semiconductor demand.
