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45 min ago 2 min read
South Korean semiconductor chemicals manufacturer Dongwoo Fine-Chem has signed a joint venture agreement with electric components manufacturer Samsung Electro-Mechanics to commercialise glass core substrate (GCS) technology for advanced semiconductor packages.
Subject to approvals, the new company is expected to launch this year and establish a supply system for GCS technology in the second half of 2027.
Specialty gases are used in the through-glass via (TGV) formation and metallisation stages of GCS manufacturing.
The new company will combine Dongwoo Fine-Chem’s glass processing and manufacturing capabilities with Samsung Electro-Mechanics’ substrate design and commercialisation expertise to advance GCS development.
Within advanced semiconductor packages, GCS provides a stable inner layer, composed of copper TGVs, which support signal transmission.
GCS has properties that contribute to higher-density wiring, thermal stability, flatness, rigidity, and electrical performance compared to standard organic materials.
Its properties are compatible with the increasing density and greater package enlargement requirements of AI-related semiconductors.
Dongwoo Fine-Chem is a wholly-owned subsidiary of Japanese chemicals firm Sumitomo Chemical.
GCS outlook
Rising investment in AI infrastructure is increasing demand for advanced semiconductor packaging technologies. The global semiconductor industry is expected to reach $975bn in sales this year.
However, the GCS market is still in its early stages, with supply chains and industry standards continuing to develop.
According to a recent GCS market and development trends report, released by semiconductor organisation SEMI and research firm Global Net Corp (GNC), GCS technology represents a potential $13bn opportunity by 2040.
The report projects the GCS market will have a compound annual growth rate of 67.2% between 2028 and 2040.
However, SEMI and GNC caution that wider adoption will depend on overcoming manufacturing bottlenecks, including TGV design, metallisation processes, and glass cracking during production.
